Pallamerse? SMT 2000 Electroless Palladium

 
 
 

Pallamerse??Electroless Palladium is an electroless palladium process specifically formulated for use in combination with?Duraposit? electroless nickel baths and?Aurolectroless? immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The?Pallamerse? is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.

Key Benefits:

  • High bath stability
  • Uniform Deposits
  • Bondable with gold, copper and aluminum wire
  • Excellent solderability
  • Cost-effective alternative to electrolytic nickel-gold
  • RoHS compliant
 
 
 
 
 
 
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