Visionpad? Polishing Pads

The Visionpad? pad series for chemical mechanical planarization (CMP) is a platform designed for multiple applications and advanced nodes. Visionpad? technology is engineered with unique polymer chemistry, including optimized pore size and porosity levels. This leads to a range of polishing performance options depending on process requirements.

  • The Visionpad? 3000 series of polishing pads is designed to achieve the defect levels of the Politex? pad with the pad planarization capabilities of the IC1000? pad in Copper barrier processes. The Visionpad? 3000 series has a softer surface than an IC1000? pad to reduce defects, while maintaining a high stiffness to provide superior planarization.

    Benefits:

    • Improved defectivity compared to IC1000?
    • Improved planarization compared to soft pads

    Applications:

    • Copper barrier
  • The Visionpad? 5000 series is designed for use in Oxide and Tungsten applications. Visionpad? 5000 series pads exhibit predictable pad-to-pad performance, offer stable operation throughout the process, and demonstrate a similar or increased pad life when compared to IC1000? pads.

    Benefits:

    • Improved planarization compared to IC1000?
    • Longer pad lifetime due to low cut rate

    Uses:

    • Tungsten, STI/Ceria, Oxide
  • The Visionpad? 6000 series of polishing pads is designed to significantly improve defectivity and dishing performance as well as extend the pad lifetime compared to IC1000?.

    Benefits:

    • Step-out defectivity performance
    • Long pad lifetime due to low cut rate

    Applications:

    • Copper bulk, STI/Ceria, Oxide
  • The Visionpad? 7000 series of polishing pads is designed to significantly improve lifetime compared to IC1000?.

    Benefits:

    • Long pad lifetime due to low cut rate

    Applications:

    • Copper Bulk, STI/Ceria, Oxide, Tungsten
  • The Visionpad? 9000 series of polishing pads is designed to reduce defectivity and dishing as well as extend the pad lifetime compared to IC1000?.

    Benefits:

    • Reduced defectivity performance
    • Improved dishing performance
    • Long pad lifetime due to low cut rate

    Applications:

    • Copper Bulk, STI/Ceria, Oxide
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